CUHK hosted the Professional Forum for High Density Electronic Packaging Materials and Devices in the Greater Bay Area on 23 November, gathering a hundred top experts to discuss the future development of the field.

The event, held at the Yasumoto International Academic Park, is one of the sub-forums of the X-Lake Forum 2024, a major initiative jointly launched by the Ministry of Science and Technology and the Shenzhen Municipal Government in 2021 to promote sustainable development. It is hosted by the Joint Laboratory for High Density Electronic Packaging Materials and Devices, and co-organised by CUHK, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (SIAT), and Shenzhen Institute of Advanced Electronic Materials.

This forum focused on the latest research output and industry trends in the field of electronic packaging materials and devices, and brought together around 100 top experts, scholars and industrial practitioners from the Greater Bay Area to discuss the future development of electronic packaging materials and devices. Chaired by Professor Xu Jianbin, Associate Dean of the Faculty of Engineering and Academic Vice President of SIAT, various guests from academia and the industry attended the forum, including Dr Zhang Lin, Director of Shenzhen Science, Technology and Innovation Bureau; Professor Alan Chan, Provost of CUHK and Professor Wu Chuangzhi, Secretary of the Party Committee and Vice President of SIAT ; Dr Daniel Shi, Vice President of Hong Kong Applied Science and Technology Research Institute, Professor Sun Rong, Director of the Centre of Advanced Electronic Material Research of SIAT; and Professor Tsang Hon-ki, CUHK Dean of Faculty of Engineering.

In his speech, Professor Xu said the R&D alliance of Shenzhen and Hong Kong would help the Greater Bay Area become an important innovation powerhouse for the country to participate in the development of the world’s advanced manufacturing base.

Professor Chan and Professor Wu unveiled the “Joint Laboratory Plaque”, a sign of the organisers’ commitment to promoting deep integration of industry, academic and research sectors, as well as future cultivation of high-calibre research and technological talents. A presentation session by eight speakers followed. Later, guests also visited the Science and Technology Park, the Applied Science and Technology Research Institute, and the Institute of Science & Innovation of the Chinese Academy of Sciences.